Integrated circuit controlled ejection system (ICCES) for massively parallel integrated circuit assembly (MPICA)

ABSTRACT

Methods, systems, and apparatuses are described for integrated circuit-controlled ejection system (ICCES) for massively parallel integrated circuit assembly (MPICA). A unique Integrated Circuit (IC) die ejection head assembly system is described, which utilizes Three-Dimensional (3D) Printing/Etching to achieve very high-resolution manufacturing to meet the precision tolerances required for very small IC die sizes.

CROSS-REFERENCE TO RELATED APPLICATION(S)

This application claims the benefit of U.S. Provisional PatentApplication No. 62/637,307, entitled “Integrated Circuit ControlledEjection System (ICCES) for Massively Parallel Integrated CircuitAssembly (MPICA),” filed Mar. 1, 2018, which is hereby incorporated byreference in its entirety herein.

BACKGROUND Technical Field

The embodiments herein relate to integrated circuit-controlled ejectionsystem (ICCES) for massively parallel integrated circuit assembly(MPICA) and strap-interposers.

Background Art

A first parallel IC assembly system was built in 2004, which used amechanical pushpin system to push multiple die in parallel onto anantenna substrate for the manufacture of RFID devices. This pushpinsystem was difficult and expensive to fabricate and was not scalabledown to the smaller dimensions required for very small die sizes.

BRIEF SUMMARY

Methods, systems, and apparatuses are described for integratedcircuit-controlled ejection system (ICCES) for massively parallelintegrated circuit assembly (MPICA), substantially as shown in and/ordescribed herein in connection with at least one of the figures, as setforth more completely in the claims.

BRIEF DESCRIPTION OF THE DRAWINGS/FIGURES

The accompanying drawings, which are incorporated herein and form a partof the specification, illustrate embodiments and, together with thedescription, further serve to explain the principles of the embodimentsand to enable a person skilled in the pertinent art to make/use them.

FIGS. 1-94 illustrate numerous structures and processes for parallelintegrated circuit assembly, according to example embodiments. FIGS.95-97 illustrate numerous structures and processes for a single “pinplate” layer with push pins, according to example embodiments. FIGS.98-133 illustrate numerous structures and processes forstrap-interposers and assemblies, according to example embodiments.

Embodiments will now be described with reference to the accompanyingdrawings. In the drawings, like reference numbers indicate identical orfunctionally similar elements. Additionally, the left-most digit(s) of areference number identifies the drawing in which the reference numberfirst appears.

DETAILED DESCRIPTION

Introduction

The present specification discloses numerous example embodiments. Thescope of the present patent application is not limited to the disclosedembodiments, but also encompasses combinations of the disclosedembodiments, as well as modifications to the disclosed embodiments.References in the specification to “one embodiment,” “an embodiment,”“an example embodiment,” etc., indicate that the embodiment describedmay include a feature, structure, or characteristic, but everyembodiment may not necessarily include the particular feature,structure, or characteristic. Moreover, such phrases are not necessarilyreferring to the same embodiment. Further, when a particular feature,structure, or characteristic is described in connection with anembodiment, it is submitted that it is within the knowledge of oneskilled in the art to affect such feature, structure, or characteristicin connection with other embodiments whether or not explicitlydescribed. Furthermore, it should be understood that spatialdescriptions (e.g., “above,” “below,” “up,” “left,” “right,” “down,”“top,” “bottom,” “vertical,” “horizontal,” etc.) used herein are forpurposes of illustration only, and that practical implementations of thestructures described herein can be spatially arranged in any orientationor manner. It is contemplated that different embodiments describedherein may be implemented together in various combinations, as would beapparent to one of skill in the art having the benefit of thisdisclosure. That is, embodiments described herein are not mutuallyexclusive of each other and may be practiced alone, or in anycombination. Numerous embodiments are described in the detaileddescription and figures provided.

Example Embodiments

Pick and place techniques are often used to assemble electronic devices.Such techniques involve a manipulator, such as a robot arm, to removeintegrated circuit (IC) dies from a wafer and place them into a diecarrier. The dies are subsequently mounted onto a substrate with otherelectronic components, e.g., antennas, capacitors, resistors, inductors,to form an electronic device.

Pick and place techniques involve complex robotic components and controlsystems that handle only one or two etc. die at a time. This has adrawback of limiting throughput volume. Furthermore, pick and placetechniques have limited placement accuracy, and have a minimum die sizerequirement. One type of electronic device that may be assembled usingpick and place techniques is any RFID “tag.” RFID tags may be affixed toany item whose presence is to be detected and/or monitored.

With the presence and advancements of “The Internet of Things” (IoT) andit evolving to where every and all objects, animals or people will beprovided with unique identifiers and have the ability to transfer dataover a network without requiring human-to-human or human-to-computerinteraction. The IoT evolved from the convergence of wirelesstechnologies, micro-electromechanical systems (MEMS) and the Internet.These IoT advancements are leading to the affixing of a tag with aunique identifier to each and every item, and their checking andmonitoring by devices known as “Smart Cell Phone readers.”

As the market demand increases for products such as these uniqueidentifiers tags, and with the advances of technology and die sizesshrinking, the need for high assembly throughput rates for very smalldie, and low production costs will be crucial in providing thesecommercially-viable products. Accordingly, what is needed for thisrequirement is a method and apparatus for the ultra-high-volume assemblyof these electronic tags for the Internet of Things (IoT) and that iswhat is discussed and described here. As one browses through theInternet, one does not find any information about the implementation andmanufacturing reality of this world changing Internet of Everything.This is what this disclosure answers with Massive Parallel IntegratedChip Assembly (MPICA) technology. MPICA enables the true reality of theInternet of Everything, and ultimately achieve total world connectivity.Why is MPICA important? There are no other technologies today that canproduce a tag in the volumes or at the costs that allow companies tohave a good Return on Investment (ROI). For example, the current cost ofthe Near Field Communication (NFC) microchips are driven by the area ofthe silicon in the microchip. The typical size of an NFC microchip is˜0.5 mm squared which means that the silicon microchip in very largequantities is priced at around 5 cents. When you have to add the costfor the copper coil, as well as the cost of attaching the coil to themicrochip, the cost of the label and the integration into the label, itbecomes obvious that even in large volumes (1 Trillion) an NFC tag isunlikely to be available for under 10 US cents. With MPICA we arecapable of offering an NFC tag for only 1 US cent (or less) in volumesof trillions per year.

Proctor and Gamble (“P&G”) in 2014 sold 41,500,000,000 products fromonly 23 different brands that year with @ $83,000,000,000 revenue fromthose sales. If you made them apply 1 tag @ a cost of 10 US cents onevery one of those 41.5 billion products sold, it would have cost them@$4,150,000,000.00 to implement, which is about 5% of their net sales.With slim margins in today's world that percentage would be anon-starter. But, if you offered a 1 US penny tag to P&G, the cost toimplement would be $415,000,000.00 which would be only @ 0.5 percent ofnet sales.

Proctor and Gamble's CEO announced that their 2015 yearly advertisingbudget would be $2,900,000,000.00 and of which $1,015,000,000.00 willexclusively be spent on digital advertising through the web and print.Which equates to 35% of their total advertising budget. If P&G used only41% of their digital advertising budget for direct marketing throughtouch sales from smart phones that would be $416,150,000.00. With thetag cost to implement at only $416,150,000 and at only 41% of theirdigital advertising dollars it would pay for everything and create ahuge ROI for P&G.

NFC will take mobile marketing to a whole new level. NFC enables the useof contactless communication between devices like smartphones or tabletsthat allows any user the ability to wave their personal communicationdevice(s) over an NFC-compatible device to send information withoutneeding to touch the devices together or go through multiple steps toset up a connection. The short-range wireless RFID technology will bringmarketers and consumers together like never, bringing the capability forthe real-time exchange of any content and/or data. How much is theInternet of everything worth? $19 trillion The Internet of Everythingwill have five to 10 times the impact on society as the Internet itself,says Cisco CEO John Chambers.

Cisco CEO John Chambers says a new tech market is coming that willgenerate an astounding $14 trillion in profits over the next decade: TheInternet of Things (IoT). IoT is about putting all sorts of inanimateobjects on the Internet like cars, door locks, appliances, smart meters,video surveillance, health care devices, and thermostats and so on. “TheInternet of Things, I think will be the biggest leverage point for IT inthe next 10 years, $14 trillion in profits from that one concept alone”.He's basing this on Cisco's research. Cisco recently released its latestreport on Internet trends. The report predicted that by 2017, there willbe about 2.8 billion machines on the Internet, representing 30% of thedevices connected to the internet worldwide, up from 960 million devicesand 17% in 2012. These devices will lead to apps, services, support jobsand will cause businesses and service providers to upgrade theirnetworks, too. Cisco has even coined its own phrase for this: the“Internet of Everything.” The Internet of Everything will put a lot ofmoney in a lot of company's pockets, Cisco among them.

NFC has such a broad range of applications that the much lesssophisticated quick response (QR) codes (Barcode) pale in comparison.Although QR technologies can be effective for delivering information toconsumers, NFC technologies take this concept beyond the stars, allowingunlimited information to be instantaneously transferred and exchangedbetween individuals and organizations. NFC has much greater functionaluses and the potential to ultimately transform the way how allbusinesses are conducted. For example:

Data on all purchasing behavior collected through NFC exchanges willallow marketers to more effectively target and deliver the right type ofmarketing content to appeal to and engage with users. It will also makeit easier to manage and promote customer loyalty and reward programs,and consumers will no longer need to carry around reward cards andcoupons. Individuals will also be able to automatically spread the wordabout incentives and deals on social networks via automatic NFC-enabledsharing.

NFC tags will be placed in various print media, such as signage,magazines, product displays, and packaging. The tags are capable ofreading the preferences and purchasing data of anyone with anNFC-enabled smartphone. This allows marketing messages to be customizedto target and attract specific individual consumers.

Smart posters containing custom URL-programmed NFC tags enable seamlesstransactions with mobile users. Smart posters have been successfullyused by businesses including Samsung, VH1, and Lipton. In addition totransferring digital media such as music and video, smart posters candeliver information like product availability and purchase locations.

NFC tags will also equip marketers with real-time analytics to trackengagement with a campaign. Furthermore, geo-location mapping willprovide specifics on the time and place of transactions andinteractions. With data so precise and readily available, businesseswill have a greater ability to refocus their efforts in real time andincrease their ROI.

NFC has a number of other potential applications that could be farreaching, impacting the way business is done for transit systems,healthcare providers, banks, ticketing outlets, and more. It can also beused to provide things like electronic keyless entry. The potential forincreased revenue and reduced expenses makes this technology veryappealing for a variety of organizations.

NFC capabilities are currently being incorporated into the networks ofmobile carriers, as this technology is set to become the new standardfor location-based marketing and communications in the near future.

With the capabilities of NFC technology, every mobile device will becomeeven more crucial to individuals than they already are today. It willbecome the standard of exchange for business transactions, eventuallyreplacing credit cards and even cash for the average consumer.

Payment systems and marketing loyalty programs will be only thebeginning for NFC technology. In addition to the mounting interest inNFC for mobile access control, this technology will empower moreefficient, effective industrial applications. Specifically, combiningNFC enabled smartphones with ruggedized RFID tags offers additionalbenefits when compared to traditional RFID solutions. When anapplication requires frequent interaction with tags at numerous processpoints by many different parties, the high expense of using traditionalhandheld readers is extremely cost prohibitive. By replacing handheldreaders with NFC smartphones at data collection points, the ROI for theapplication increases.

Additionally, while the NFC standards for tags enable a broad variety ofuse cases and security, the concept of “trust” will allow for theability to confer trust onto any item(s) that are the subject oftransactions between individuals and organizations.

In embodiments, a unique Integrated Circuit (IC) die ejection headassembly system is described, which utilizes Three-Dimensional (3D)Printing/Etching to achieve very high-resolution manufacturing to meetthe precision tolerances required for very small IC die sizes. Hundredsof thousands of die are retained in this head assembly system until theyare selectively ejected in a very controlled and precise way onto anunderlying substrate, which they are then attached to. An arbitrarilylarge number of die can be selected and ejected at a time until all thedie are ejected from the head assembly system.

The Integrated Circuit Controlled Ejection System (ICCES) embodimentsprovide a new approach for Massively Parallel Integrated CircuitAssembly (MPICA). The system is a complex die retention and ejectionsystem that has the size and footprint of a standard silicon wafer onwhich the die are fabricated. For a die size of 250 microns on a side,there are about 900,000 such die on a 12-inch wafer.

The ICCES system embodiments may have several components, or systemlayers that are described below:

Die retention layer: this layer provides die retention “cubbies” inwhich the die resides until ejected onto an adjacent substrate. Thecubbies are manufactured with 3D Printing/Etching to be a specifieddimension larger than the die size and are placed exactly to correspondto the placement of the die on the wafer. At the bottom of the cubbiesthere is a hole of a specified diameter that connects to the push-pistonassembly layer, to be described next. Through this hole is a pin with aradius of a specified dimension less than the hole radius, with a pistonattached, with the same dimension as the die. The thickness of thepiston is some specified dimension. The depth of the cubbie is the sumof this dimension and the die thickness. See FIGS. 1-94. In between thecubbies is a material that serves as a “stop” for standard industrylaser scribing of the wafer. A “tacky” adhesive is applied to thebackside of the wafer containing the die, specified to provide asticking force of a value less than achieved when the die are attachedto the target substrate. The wafer is then placed on the die retentionsurface with the die facing outward. The push pistons are deployedupward to touch the adhesive layer to secure the die onto the pistonsurface. See FIGS. 1-94. An anisotropic adhesive film, such as availablefrom 3M, is placed over the wafer. This entire assembly is then scribedby standard industry laser scribing, to separate the die. Duringscribing, the pistons exert a specified downward force, pulling on thedie, so when separated, the die are pulled into the cubbies, along withthe anisotropic adhesive layer. Once in the cubbies, the adhesive keepsthem retained.

Push Piston layer: this layer has either round, rectangular, or squarechambers aligned with the cubbies. The piston pin hole connects achamber to its corresponding cubby. The chambers have pistons connectedto these pins, the radius being a specified dimension less than theradius of the chamber, or of the size being specified dimensions lessthan the rectangular or square dimensions of the chamber. The thicknessof the piston is of some specified dimension. The chamber depth is thesum of this dimension and the die thickness. See FIGS. 1-94. The pistonsare manufactured so that they move freely up and down, the totalexcursion being the same as the die thickness. At the opposite end ofthe chamber from the cubby piston hole, is a hole to the air manifold,to be described next. See FIGS. 1-94. This air manifold provides firstpositive pressure to push the chamber piston down to the cubby end,pushing the cubby piston up to meet the die underside surface when thedie wafer is placed on the assembly as described above. Then is providesthe negative pressure to pull the chamber piston up and away from thecubby side, pulling the cubby piston down to the bottom of the cubby,bring the attached die down into the cubby. When the target substrate isbrought into near contact proximity to the cubby surface, positive airpressure is applied to once again move the chamber piston down to thecubby side, pushing the chamber piston up and the die out of the cubby,ejecting it onto the substrate where it is attached by the anisotropicadhesive. The attachment force is designed to be sufficient to pull thedie off of the piston. Then negative air pressure is once more inducedto withdraw the cubby piston into the cubby, leaving the die attached tothe substrate.

Air Chamber layer: This layer is a separate and moveable layer relativeto the integrated cubby/piston chamber layer. It has air holes matchedto those in the piston chamber layer, but at locations specific to thenumber of die to be ejected at any one time. For example, it may haveair holes located to correspond to the bonding pad position of anunderlying substrate, which require only a fraction of the total die tobe ejected and bonded at a time. Once those dies are ejected, theintegrated cubby/piston chamber layer is moved relative to the airchamber layer, such that filled cubbies are aligned to the air holes ofthe air chamber, for the next ejection of die onto a new segment of thesubstrate, which is on a reel, and advances to expose new bonding padpositions. The air chamber air holes and the corresponding pistonchamber air holes may be male-to-female matched to provide an airtightfit when positioned together. The air chamber is a cavity withdimensions commensurate with the wafer, and some thickness dimensiondesigned to provide uniform pressure throughout the chamber duringcycles. An air hose connects this chamber to a pressure pump system toalternatively provide the negative and positive pressures. See FIG. 5.Purified nitrogen gas may be a preferred gas for this operation toprevent contamination and oxidation of interior surfaces, according toan embodiment. Alternatively, the air chamber layer may be integratedwith the cubby/piston chamber layer. In this case, the chamber may befilled with channels that direct the gas flow to the specified pistonchambers for a specific die ejection cycle, and then to different pistonchambers for the next die ejection cycle. Computer controlled microvalves select which channels are employed for a specific push cycle. SeeFIGS. 1-94.

Alternatively, the cubby pistons may be activated by a mechanical pistonlayer, operated electro-magnetically with solenoids, such as is shown inone or more of FIGS. 1-94. There may be individual solenoids, one foreach antenna position, or just one that operates a pin plate, the pinspositioned one for each antenna position. In either alternative, once aset of die are ejected, the integrated cubby/piston chamber layer ismoved relative to the mechanical piston layer, such that filled cubbiesare aligned to the pins, for the next ejection of die onto a new segmentof the substrate.

The subject matter disclosed herein also includes a two-sided ID diewhich has bonding pads on both the top and bottom surfaces of the die,as shown in one or more of FIGS. 1-94. For such die, the die can beattached to one side of an antenna or other substrates as describedabove, or within a pre-embossed shape equal to that of the thickness ofthe 2 sided I/O bare die, said embossed shape may also have a via or notto allow for a connection to the opposite side of substrate when foldedor just to connect to another substrate. After or before thatattachment, a conductive adhesive (anisotropic, isotropic, or other) maybe applied on the exposed top or bottom die surface, covering eitherbonding pad(s), as shown in one or more of FIGS. 1-94. After the antennaor other flexible substrate exits the ICCES stage, it may then be fanfolded either over the die or back-to-back, a passivation covering maybe applied between both antenna structures by Printing/Etching or othermeans as not to short out either or both antenna structures, but withthe pad area exposed for connection to die I/O, so that bonding landingson the substrate match the adhesive covered top die surface and thenbrought into contact with pressure to form the bond attachment, as shownin one or more of FIGS. 1-94. Upon the completion of the fan folding oneedge of the stack is then sliced to sever individual antennas which maythen be read or authenticated for functioning/nonfunctioning. Said stackmay be counted, and or packaged, as shown in one or more of FIGS. 1-94.

In an embodiment, a unique Integrated Circuit (IC) die ejection headassembly system is described, which utilizes one of many types ofThree-Dimensional (3D) Printing/Etching technologies to achieve veryhigh-resolution manufacturing to meet the precision tolerances requiredfor very small IC die sizes. Hundreds of thousands to more than amillion of randomly Laser programmed unique die are retained in this“First” assembly system until they are selectively ejected in a verycontrolled and precise way onto any various underlying web likesubstrates. These arbitrarily large number of die can be selecteddepending on a predetermined pattern and ejected all at the same timeuntil eventually every die are ejected from the “First” assembly system.The Integrated Circuit Controlled Ejection System (ICCES) embodimentsprovide a new approach for MPICA. The current “6” layer embodiment is acomplex die retention and ejection system that has the size andfootprint of any standard silicon wafer on which IC die are fabricated.For a die size of 200 microns on a side, there are about 1,400,000 suchdie on a 12-inch wafer.

The ICCES system embodiments may have several components, or systemlayers that are described below:

The “First” layer: or the Centralized Air Plate layer (CAP) which likeevery other part is manufactured with a high-resolution 3D typePrinting/Etching process. The CAP layer is further described elsewhereherein.

The “Second” layer or the Push-Pin-Piston Assembly (PPPA) layer providesa plate or individual “Push Pins” to extract die from wafer on the WaferPlate, The PPPA layer is further described elsewhere herein.

The “Third” layer is the Wafer Plate or the Die Retention Layer (DRL)provides die retention “cubbies” with vias in which the wafer andrandomly Laser programmed unique die reside until ejected onto anadjacent substrate. The DRL layer is further described elsewhere herein.

The “Forth” layer is “Wafer” itself which is of any size or part of anywafer. It is jigged to fit exactly over each “Cubby” and via as to beable to be ejected from the PPPA. The Wafer layer is further describedelsewhere herein.

The “Fifth” layer is the “Conductive Adhesive” layer (Isotropic, orAnisotropic) which is applied over the complete “Wafer” and die cutexactly to the shape of that “Wafer”, or can be a liquid that flows onthe “Wafer” and presets and semi cures or cures enough so that eithercan be then scribed, diced or cut into the same size dimensions as thedie ejected from the DRL. The Conductive layer is further describedelsewhere herein.

The “Sixth” layer is the “Membrane Surface” or “substrate” to which theIC or die is being applied to create a circuit or connection. TheMembrane layer is further described elsewhere herein.

The “First” Layer, the Centralized Air Plate layer (CAP) module providesthe ICCES system to operate by providing either a continuous movingplate or individual air ports or vias with pre-determined pattern(s).For example, for a 12″ wafer with a solid or continuous CAP moves like a12″×12″ piston moving up and down to a specified distance which isdetermined only by the thickness of the wafer. For a CAP with individualair ports or vias, air is pushed through the individual predeterminedpatterned holes. This CAP layer is a separate and moveable layerrelative to the “Second” layer the Push-Pin-Piston Assembly (PPPA)layer.

The CAP may be a cavity with dimensions commensurate with the wafer, andsome thickness dimension designed to provide uniform pressure throughoutthe chamber plate during cycles. An air hose connects this chamber to apressure pump system to alternatively provide the negative and positivepressures, as is shown in one or more of FIGS. 1-94. Purified nitrogengas may be a preferred gas for this operation to prevent contaminationand oxidation of interior surfaces, according to an embodiment.Alternatively, the air chamber layer may be integrated with thecubby/piston chamber layer. In this case, the chamber may be filled withchannels that direct the gas flow to the specified piston chambers for aspecific die ejection cycle, and then to different piston chambers forthe next die ejection cycle. Computer controlled micro valves selectwhich channels are employed for a specific push cycle.

The airtight fit when positioned together create the air chamber orcavity with dimensions commensurate with the wafer, and some thicknessdimension designed to provide uniform pressure throughout the chamberduring cycles. The air hose connects this chamber to a pressure pumpsystem to alternatively provide the negative and positive pressures.

Purified nitrogen gas may be a preferred gas for this operation toprevent contamination and oxidation of interior surfaces, according toan embodiment. Alternatively, the CAP layer may be integrated with asdescribed above to a cubby/piston chamber layer. In this case, thechamber is filled with channels that direct the gas flow to thespecified piston chambers for a specific die ejection cycle, and then todifferent piston chambers for the next die ejection cycle. Computercontrolled micro valves may select which channels are employed for aspecific push cycle.

The CAP is then attached to the “PPPA” becoming one subassembly and hasthe ability to move together in a specific pattern to allow for thecomplete wafer to be exhausted of every one of its die, as is shown inone or more of FIGS. 1-94. For example, for a 0.5″×1″ antenna for anRFID tag the feasibility is such that one can push 208 200-micron sq.IC's per push, per second. After 1 set push the plate then move 200microns in the “X” direction to initiate another push, then another,etc. until all die within each 208 patterns are completed. Roughly eachpattern may have @ 57 die in the “X” direction and @115 die in the “Y”direction giving each push pin the ability to push 6,555 die and a totalof 1,363,440 200 Micron sq. die pushed in 6,555 seconds or @ 1.8 hours,as is shown in one or more of FIGS. 1-94.

The “Second” layer, the Push-Pin-Piston Assembly (PPPA) layer provides apredetermined patterned plate with holes for “Push Pins”, orpredetermined patterned individual cavities each with holes for “PushPins”. This layer's individual cavities can have either round,rectangular, or square chambers, likewise the predetermined patternedplate may as well, or just simply be a lid like shape to create an airchamber with the predetermined pattern. One example is where the PPPApin hole connects a chamber to its corresponding cubby on the DieRetention Layer (DRL). The chamber(s) may have pistons connected tothese pins with their radius being of a specified predetermineddimension or pattern less than the radius of the chamber, or dimensionsless than the rectangular or square dimensions of the chamber. Thethickness of the PPPA is of some specified dimension of the chamberdepth which is the sum of this dimension and the die thickness, as isshown in one or more of FIGS. 1-94. The PPPA manufactured assembly ismade so that they each move freely up and down with their totalexcursion being the same as the die thickness.

When the target substrate, or “Membrane Surface” is brought into nearcontact proximity to the cubby surface As the CAP provides firstpositive pressure to push the PPPA down on to the DRL bottom surface,the action results in pushing either the cubby piston or plate down tomeet the die underside surface. The defined positive air pressure whichis applied and moves the chamber piston or plate down onto the cubbyside, pushing the chamber piston or plate down and the die out of theDRL, ejecting it onto the “Membrane Surface” where it is attached by the“Conductive Adhesive” layer. The attachment force is designed to besufficient to pull the die off of the PPPA. Then negative air pressureis induced to the CAP to withdraw the PPPA piston off the DRL cubby,leaving the die attached to the “Membrane Surface”. This is thecompletion of one cycle.

Alternatively, the cubby pistons may be activated by a mechanical pistonlayer, operated electro-magnetically with solenoids, such as is shown inone or more of FIGS. 1-94. There may be individual solenoids, one foreach antenna position, or just one that operates a pin plate, the pinspositioned one for each antenna position. In either alternative, once aset of dice are ejected, the integrated cubby/piston chamber layer ismoved relative to the mechanical piston layer, such that filled cubbiesare aligned to the pins, for the next ejection of die onto a new segmentof the substrate. Alternatively, the previous layers may be replaced bya single “pin plate” layer, FIG. 95-97, which is a plate with push pinsformed upon it located in alignment with the sixth layer pattern ontowhich the die are to be pushed and attached.

The “Third” layer is the Wafer Plate or the Die Retention Layer (DRL)which simply provides for any size wafer with any size die pattern apre-patterned wafer retention stencil with vias or holes patternedthrough each die location center. In another embodiment, each DRL mayalso have each and every die scribe line printed/Ablated to height as tocreate individual Cubby wall patterns for each die allowing for betterdie and wafer stabilization. The Cubby wall patterns can also allow foreach die Singulation process an exact pattern to follow for either thescribing saw blade or the laser scribe.

The Die Retention Layer (DRL) is where the wafer and die reside untilejected onto an adjacent substrate. For example, it has holes located tocorrespond to the bonding die position of the Membrane Surface, theunderlying substrate, which require or receives only a fraction of thetotal die to be ejected and bonded by the Conductive Adhesive at a time.This is determined by the predetermined pattern or antenna size. Oncethose die are ejected, the integrated CAP and PPPA layer is then movedtogether relative to the next predetermined pattern, as in one or moreof FIGS. 1-94.

The “Forth” layer is the “Wafer” itself which is of inclusive of anysize or part of any randomly Laser programmed unique wafers. It isattached to a pre-patterned wafer retention stencil with vias or holespatterned under each randomly Laser programmed unique die center andable to be ejected by the PPPA off the DRL. The randomly Laserprogrammed unique wafers can be whole 18″, 12″, 8″, 6″, or 4″. They alsocan be cut out to a pattern that allows for multiple wafers to be puttogether like a puzzle creating one large continuous wafer and appliedto one continuous Wafer plate or DRL. By doing this it allows for unusedor nonfunctional die to be excised as to create 100% usable die, as isshown in one or more of FIGS. 1-94.

The “Fifth” layer is the “Conductive Adhesive” layer (Isotropic,Anisotropic or other) which is applied over the complete “Wafer” and diecut exactly to the shape of that “Wafer”, or can be a liquid that flowson the “Wafer” and presets and semi cures or cures enough so that eithercan be then scribed, diced or cut into the same size dimensions as thedie ejected from the DRL. Also, the adhesive can be stenciled over aselect area or die to be attached, as is shown in one or more of FIGS.1-94.

The “Sixth” layer is the “Membrane Surface” or “Target Substrate” towhich the IC or die is being applied to create a circuit or connection.This layer is a Preprinted/Ablated/Ablated pattern on a continuous web,like that of a newspaper the continuous pattern if printed/Ablated orablated to match the PPPA pattern.

The sixth layer Preprinted/Ablated/Ablated pattern can be an antenna,such as for a RFID tag, upon which the die is attached to form the tag.Or it can be what is known as an “interposer” or “strap” upon which thedie is attached, FIG. 98-100. The strap has both “bonding pads” uponwhich the die is attached and “connecting pads” which enables the strapto be attached to some other substrate material to form an electricalcircuit or device, which could be an antenna, such as for a RFID tag.

A sample embodiment for a strap which is to be connected to a coilantenna substrate is shown in FIG. 101. In embodiments, an integratedcircuit-controlled ejection system (ICCES) for massively parallelintegrated circuit assembly (MPICA) configured to form a targetsubstrate with a strap-interposer is provided, e.g., in systems 9800 and11800. The ICCES may include a first formation device 11802 configuredto form the strap-interposer on the target substrate based on one ormore dimensions of an antenna for the target substrate, and a secondformation device 11804 configured to form a first portion of a commonground testing structure that is electrically coupled to thestrap-interposer, the common ground testing structure configured to testfunctionality of an assembly. In embodiments, first, the strap length isdetermined by the length across all antenna coils, shown in FIG. 102.The web of antenna straps is then printed/Ablated (e.g., formed) alongwith common ground test structures, shown in FIG. 103. The ICCES mayalso include a third formation device 11806 configured to form adielectric structure over the first portion of the common ground teststructure and the strap-interposer. For example, dielectric structuresare printed/Ablated over the common ground structures, shown in FIG.104. The ICCES may also include a fourth formation device 11808configured to form a completed target substrate by forming a secondportion of the common ground testing structure over the dielectricstructure and that is electrically coupled to the strap interposer,shown in FIG. 104-105. For instance, the rest of the individual teststructures are printed/Ablated over the dielectric structures to formthe completed strap “Target Substrate” upon which the die is attached.In embodiments, one or more of the formation devices described for theICCES may be combined or part of a common formation device. The ICCESmay also include a placement device 9800 configured to attach a diestructure to the completed target substrate to complete formation of anassembly, as exemplarily shown in FIG. 106. The test structures allowthe completed die/strap assemblage to be immediately tested forfunctionality as shown in FIGS. 105-111. Bad assemblages can then bemarked in some manner for later removal as shown in FIG. 112. Aftertesting and marking bad strap assemblages a lamination of patternedgummed pressure-sensitive adhesive (PSA) construction is appliedcovering everything but the connecting pad areas, as shown in FIGS.113-116. This resulting assemblage is then die cut to separateindividual straps but leaving all interconnect lines, as shown in FIG.117. The resulting waste material is then striped out and the marked badstraps are extracted, as shown in FIG. 112. Then narrow rows are slitfor straps of the desired length and width, which are packaged into ananti-static container, as shown in FIG. 118. Each such packaged rollwill have its own unique ID, which could be a random number, to providetraceability for each phase of its construction back to its rawmaterials. The straps can then be applied to stock paper prior to thePrinting/Etching of any antenna structures as shown in FIG. 119-120.Once the strap is applied to stock paper then the Printing/Etching ofantenna structures is completed directly over the strap completing thestrap/antenna circuit as shown in FIG. 121, or vice-versa thePrinting/Etching of the antenna structure is completed as shown in FIGS.122-123. Note that the printed/Ablated antenna can be incorporated intoa security design feature, such as a hologram, on currency, postagestamps, or tax stamps, such as shown in FIGS. 124-126. They could alsobe incorporated into product labels as shown in FIGS. 127-128. Also, thecompleted tags can be applied on any number of varieties of objects forspecific purposes, such as to aid the assembly of pre-cut furniture asshown in FIGS. 129-130. Here, the random number IDs on the tags areassociated with each furniture piece they are attached to in a database,along with the assembly instructions for that piece with the others.Reading any of the tags would bring up a picture on the reading deviceof the piece in relationship with the others, along with instructions onhow to assemble that piece into the whole and could link to instructionvideos as shown in FIG. 131. This application is by way of example only,and any other application that can be envisioned using these embodiedtags are included in this patent, such as with instruction on how to usesmart appliances, verbal instructions to the blind, etc. as enable bythe cloud ecosystem data base structure shown FIG. 132. The subjectmatter disclosed herein also includes a new design for a two sidedrandomly Laser programmed unique die IC die which has at least onebonding pad(s) on both the top and bottom surfaces of the die, as shownin one or more of FIGS. 1-94. For such a die, the die can be attached toeither side of an antenna or other substrates, or within a pre-embossedshape equal to that of the thickness of the 2 sided I/O randomly Laserprogrammed unique bare die, said embossed shape may also have a via ornot to allow for a connection to the opposite side of substrate whenfolded or just to connect to another substrate. After or before thatattachment, a conductive adhesive (anisotropic, isotropic, or other) maybe applied on the exposed top or bottom die surface, covering eitherbonding pad(s), as shown in one or more of FIGS. 1-94. After the antennaor other flexible substrate exits the ICCES stage, it may then be fanfolded either over the die or back-to-back, a passivation covering maybe applied between both antenna structures by Printing/Etching or othermeans as not to short out either or both antenna structures, but withthe pad area exposed for connection to die I/O, so that bonding landingson the substrate match the adhesive covered top die surface and thenbrought into contact with pressure to form the bond attachment, as shownin one or more of FIGS. 1-94. Upon the completion of the fan folding oneedge of the stack is then sliced to sever individual antennas which maythen the randomly Laser programmed unique ID may be read orauthenticated for functioning/nonfunctioning. Said stack may be counted,authenticated from the secure database on or off site and then packaged,as is shown in one or more of FIGS. 1-94. The die/antenna assemblage isknown as a “tag”.

When the tag antenna is energized by a reader, the die is powered up andimmediately sends out its laser programmed unique ID repeatedly untilthe antenna is no longer energized by a reader. Alternatively, the dieupon powering up could wait a certain amount of time to send out its IDonly once, and then shut down. This is useful for reading multiple tags,where each tag sends out its ID at a different time. This can beaccomplished by a random number generator on the die that upon diepower-up randomly chooses a time slot out of a finite number of possibletime slots, N, in which to send out its ID. The value of N can bedetermined by laser programming counter links on the die at the sametime the unique ID is laser programmed. The value of N could be of anynumber depending on how many tags are to be expected to be read in agiven time frame, including N=0 for immediate read of a single tag.

The subject matter herein provides die assembly production capabilitiesorders of magnitude greater than any currently available, which isrequired to achieve the goal of low-cost high-volume assembly.

The subject matter herein provides die assembly production capabilitiesorders of magnitude greater than any currently available, which isrequired to achieve the goal of low-cost high-volume assembly.

Various embodiments are now described by way of example and notlimitation.

A method of operation for an integrated circuit-controlled ejectionsystem (ICCES) for massively parallel integrated circuit assembly(MPICA) performed in accordance with any of the embodiments described orshown herein.

The method, further comprising: providing at least one die retentionCubbie, in a Die Retention Layer (DRL), in which at least onecorresponding die resides until ejected onto an adjacent substrate.

The method, wherein the at least one Die Retention cubby performs afunction in accordance with any of the embodiments described or shownherein.

The method, further comprising: providing at least one push piston, in aPush Pin Piston Assembly (PPPA), to eject at least one corresponding dieinto a membrane substrate.

The method, wherein the at least one push piston from the PPPA performsa function in accordance with any of the embodiments described or shownherein.

The method, further comprising: providing a Centralized Air Plate (CAP)that is separate and moveable with respect to at least one other layerof the ICCES MPICA.

The method, wherein the Centralized Air Plate (CAP) performs a functionin accordance with any of the embodiments described or shown herein. Themethod, wherein the Centralized Air Plate (CAP) and the Push Pin PistonAssembly (PPPA) are one unit, to eject at least one corresponding dieinto a membrane substrate.

The method, further comprising: multiple wafers providing at least onepush piston, in a Push Pin Piston Assembly (PPPA), to eject at least onecorresponding die into a membrane substrate.

The method, further comprising: a minimum of one of many wafers whichprovides at least one push piston, in a Push Pin Piston Assembly (PPPA),to eject at least one corresponding die into a membrane substrate,wherein the corresponding die is programmed (i.e. ROM laser) with aunique ID to correspond to its Wafer Map and to be authenticated as anoperational device.

The method for manufacturing a “strap” or “interposer”.

A system for an integrated circuit-controlled ejection system (ICCES)for MPICA configured in accordance with any of the embodiments describedor shown herein.

The system, further comprising: a die retention layer (DRL).

The system, wherein the Die Retention Layer (DRL) is configured inaccordance with any of the embodiments described or shown herein.

The system, wherein the Die Retention Layer (DRL) includes one or moreof: a plurality of die retention receptacles formed at a surface of thedie retention layer by a three-dimensional printer; each Die RetentionReceptacle having dimensions larger than a die size, and positioned tocorrespond to the placement of a corresponding die on a wafer; each DieRetention Receptacle having a bottom surface having a hole through whicha pin is configured to extend, the pin attaching a piston having the diesize, the piston included in a plurality of pistons; each die within theDie Retention Receptacle having a top and bottom surface with at leastone pad allowing for the die to be attached up or down by the pinextending through the hole of the Die Retention Receptacle, the pin isattached to a piston or pin being smaller than the total area of thedie, the piston or pin can include a plurality of pistons or pins;wherein a first tacky or adhesive material may be used on a backside ofthe wafer containing a plurality of dies including the die, the firsttacky material is configured to provide a sticking force having a valueless than a second tacky material secures to the target substrate;wherein a first surface of the wafer containing a plurality of diesincluding the die, the first is configured with air holes to provide asticking or vacuum force holding or retaining die and wafer until asecond tacky material secures the die to the target substrate; whereinthe wafer is placed on the die retention surface with the die facingoutward, the piston(s) are deployed upward to contact the first tackylayer to secure the die onto a surface of the piston(s); wherein thewafer is placed on the Die Retention Layer (DRL) surface with the diefacing outward, the piston(s) form are deployed upward to contact withthe air holes providing a sticking or vacuum force holding or retainingdie and wafer to secure the die onto a surface of the piston(s); whereinthe second adhesive material is an anisotropic adhesive or anisotropicfilm; wherein the Die Retention Layer (DRL), Wafer and Adhesive materialare scribed by a laser to separate the dies of the wafer; or wherein thepiston exerts a downward force that pulls on the separated die to pullthe separated die into the die receptacle into contact with theanisotropic adhesive layer.

The system, further comprising: A Push Pin Piston layer (PPPL).

The system, wherein the Push Pin Piston Layer (PPPL) is configured inaccordance with any of the embodiments described or shown herein.

The system, wherein the Push Pin Piston Layer includes at least one of:a plurality of chambers aligned with a plurality die receptacles of adie retention layer, each chamber including a first hole configured toreceive a corresponding pin connected between a chamber and acorresponding die receptacle; each chamber including a piston connectedto the corresponding pin, a radius of the pin being less than adimension of the chamber, each piston configured to move up and down, atotal excursion being the at least the same as the die thickness; eachchamber including a second hole that opens from the Centralized AirPlate (CAP) configured to provide a first positive pressure to push thepiston(s) or plate down to a die receptacle end, to push the piston orplate up to a die underside surface when a wafer that includes aplurality of dies are positioned adjacent to the die retention layer;the Centralized Air Plate (CAP) is configured to provide a negativepressure to pull the piston or piston plate up and away from the diereceptacle end, to pull the piston/plate down to a bottom of the diereceptacle to bring the die into the die receptacle; wherein, when aMembrane Surface (Target Substrate) is brought into near contactproximity to the die receptacle surface, a positive pressure is appliedby the Centralized Air Plate (CAP) to move the piston/plate down to thedie receptacle end, to push the chamber piston/plate up and the die outof the die receptacle, to eject the die onto the substrate surface wherethe die is attached by an anisotropic adhesive material; wherein, theMembrane Surface (Target Substrate) which is brought into near contactproximity to the die receptacle surface, a positive pressure is appliedby the Centralized Air Plate (CAP) to move the piston/plate down to thedie receptacle end, to push the chamber piston/plate up and the die outof the die receptacle, to eject the die onto the substrate surface wherethe die is attached by an anisotropic adhesive material can be acircuit, antenna, or any specific pattern known or later defined;wherein an attachment force of the anisotropic adhesive material isconfigured to pull the die off of the piston/plate; or wherein anegative air pressure is induced by the Centralized Air Plate (CAP) towithdraw the piston into the die receptacle to leave the die attached tothe Target Substrate.

The system, further comprising: A Centralized Air Plate (CAP).

The system, wherein the Centralized Air Plate (CAP) layer is configuredin accordance with any of the embodiments described or shown herein.

The system, wherein the Centralized Air Plate (CAP) layer includes atleast one of: a plurality of air holes matched to a distribution ofholes in a piston chamber layer, but at locations specific to a numberof die of a wafer to be ejected at any one time, the number of die to beejected at any one time being less than or equal to a total number ofdie of the wafer.

The system, wherein the Centralized Air Plate (CAP) layer and the atleast one continuous piston chamber/plate layer and has predetermined 3Dprinted/Ablated, metal, plastic or other material(s) at specificpredetermined locations to a specific number of die of a wafer to beejected at any one time, the number of die to be ejected at any one timebeing less than or equal to a total number of die of the wafer.

The system, wherein the Centralized Air Plate (CAP) layer attaches to aPush-Pin-Piston Layer (PPPL) becoming one operating device with thepredetermined 3D printed/Ablated, metal, plastic or other material(s) atspecific predetermined locations to a specific number of die of a waferto be ejected at any one time, the number of die to be ejected at anyone time being less than or equal to a total number of die of the wafer.

The system, wherein the Centralized Air Plate (CAP) layer attaches to aPush-Pin-Piston Layer (PPPL) becoming one operating device with thepredetermined 3D printed/Ablated, metal, plastic or other material(s) atspecific predetermined locations to a specific number of die of a waferto be ejected at any one time, the number of die to be ejected at anyone time being less than or equal to a total number of die of the wafer,upon completion of an ejection cycle the cycle is repeated over and overagain until each Pin location has exhausted every die within itsboundary.

The System for manufacturing a “strap” or “interposer”.

The system, wherein the Centralized Air Plate (CAP) layer attaches to aPush-Pin-Piston Layer (PPPL) becoming one operating device which has itsown boundaries, and a Boundary is defined by the total number of diesbeing pushed, which is defined by the size of each Antenna, circuit orpattern defined by the Membrane Surface or Target Substrate.

A two-sided ID die configured in accordance with any of the embodimentsdescribed or shown herein.

The two-sided ID die, further comprising: a top surface that includes atleast a one bonding pad; and a bottom surface that includes at least aone bonding pad.

The two-sided ID die, wherein at least one of the top surfaces or thebottom surface includes a conductive adhesive that covers the topsurface or the bottom surface.

An Integrated Circuit (IC) die ejection head assembly system configuredin accordance with any of the embodiments described or shown herein.

The IC die ejection head assembly system, wherein an IC die ejectionhead assembly system utilizes three-dimensional (3D) Printing/Etching toachieve very high-resolution manufacturing.

The IC die ejection head assembly system, wherein the IC die ejectionhead assembly system is configured to: retain at least 800,000 die; andeject a first portion of the at least 800,000 die while retaining asecond portion of the at least 800,000 die.

The IC die ejection head assembly system, comprising subassemblies, theCentralized Air Plate (CAP) layer, and the Push Pin Piston layer (PPPL).

The IC die ejection system head assembly system, configured to eject thenext die in the next defined movement until each defined die within eachdefined pattern of each defined push-pin exhaust every die on eachdefined wafer, as shown in one or more of FIGS. 1-94 The IC die ejectionsystem head assembly system comprising multiple wafers which proceeds toeject the next die in the next defined movement until each defined diewithin each defined pattern of each defined push-pin exhaust every dieon each defined wafer, as shown in one or more of FIGS. 1-94.

An Integrated Circuit (IC) die ejection head assembly system: configuredin accordance with any of the embodiments described or shown herein;wherein the IC die ejection head assembly system utilizesthree-dimensional (3D) Printing/Etching to achieve very high resolutionmanufacturing; and/or wherein the IC die ejection head assembly systemis configured to: retain at least 800,000 die; and eject a first portionof the at least 800 k die while retaining a second portion of the atleast 800 k die.

A target substrate with a strap-interposer assembled according to themethods of any embodiment herein is also described.

An integrated circuit-controlled ejection system (ICCES) for massivelyparallel integrated circuit assembly (MPICA) configured to form a targetsubstrate with a strap-interposer is also described. The ICCES comprisesa first formation device configured to form the strap-interposer on thetarget substrate based on one or more dimensions of an antenna for thetarget substrate, a second formation device configured to form a firstportion of a common ground testing structure that is electricallycoupled to the strap-interposer, the common ground testing structureconfigured to test functionality of an assembly, a third formationdevice configured to form a dielectric structure over the first portionof the common ground test structure and the strap-interposer, a fourthformation device configured to form a completed target substrate byforming a second portion of the common ground testing structure over thedielectric structure and that is electrically coupled to the strapinterposer, and a placement device configured to attach a die structureto the completed target substrate to complete formation of an assembly.

Further Example Embodiments

A device, as defined herein, is a machine or manufacture as defined by35 U.S.C. § 101. That is, as used herein, the term “device” refers to amachine or other tangible, manufactured object and excludes software andsignals. Devices may be digital, analog or a combination thereof.Devices may include integrated circuits (ICs), one or more processors(e.g., central processing units (CPUs), microprocessors, digital signalprocessors (DSPs), etc.) and/or may be implemented with anysemiconductor technology, including one or more of a Bipolar JunctionTransistor (BJT), a heterojunction bipolar transistor (HBT), a metaloxide field effect transistor (MOSFET) device, a metal semiconductorfield effect transistor (MESFET) or other trans conductor or transistortechnology device. Such devices may use the same or alternativeconfigurations other than the configuration illustrated in embodimentspresented herein.

Techniques, including methods, described herein may be implemented inhardware (digital and/or analog) or a combination of hardware andsoftware and/or firmware. Techniques described herein may be implementedin one or more components. Embodiments may comprise computer programproducts comprising logic (e.g., in the form of program code orinstructions as well as firmware) stored on any computer useable storagemedium, which may be integrated in or separate from other components.Such program code, when executed in one or more processors, causes adevice to operate as described herein. Devices in which embodiments maybe implemented may include storage, such as storage drives, memorydevices, and further types of computer-readable media. Examples of suchcomputer-readable storage media include, but are not limited to, a harddisk, a removable magnetic disk, a removable optical disk, flash memorycards, digital video disks, random access memories (RAMs), read onlymemories (ROM), and the like. In greater detail, examples of suchcomputer-readable storage media include, but are not limited to, a harddisk associated with a hard disk drive, a removable magnetic disk, aremovable optical disk (e.g., CDROMs, DVDs, etc.), zip disks, tapes,magnetic storage devices, MEMS (micro-electromechanical systems)storage, nanotechnology-based storage devices, as well as other mediasuch as flash memory cards, digital video discs, RAM devices, ROMdevices, and the like. Such computer-readable storage media may, forexample, store computer program logic, e.g., program modules, comprisingcomputer executable instructions that, when executed, provide and/ormaintain one or more aspects of functionality described herein withreference to the figures, as well as any and all components, steps andfunctions therein and/or further embodiments described herein.

Computer readable storage media are distinguished from andnon-overlapping with communication media. Communication media embodiescomputer-readable instructions, data structures, program modules orother data in a modulated data signal such as a carrier wave. The term“modulated data signal” means a signal that has one or more of itscharacteristics set or changed in such a manner as to encode informationin the signal. By way of example, and not limitation, communicationmedia includes wired media as well as wireless media such as acoustic,RF, infrared and other wireless media. Example embodiments are alsodirected to such communication media.

CONCLUSION

While various embodiments have been described above, it should beunderstood that they have been presented by way of example only, and notlimitation. It will be apparent to persons skilled in the relevant artthat various changes in form and detail can be made therein withoutdeparting from the spirit and scope of the embodiments. Thus, thebreadth and scope of the embodiments should not be limited by any of theabove-described exemplary embodiments but should be defined only inaccordance with the following claims and their equivalents.

What is claimed is:
 1. A method of forming a target substrate with astrap-interposer, the method comprising: determining a length of thestrap-interposer based on one or more dimensions of an antenna for atarget substrate upon which the strap-interposer is to be placed;forming the strap-interposer on the target substrate based on thelength; forming a first portion of a common ground testing structurethat is electrically coupled to the strap-interposer, the first portionof the common ground testing structure configured to test functionalityof an assembly; forming a dielectric structure over the first portion ofthe common ground test structure and the strap-interposer; and forming acompleted target substrate by forming a second portion of the commonground testing structure over the dielectric structure and that iselectrically coupled to the strap interposer.
 2. The method of claim 1,further comprising: attaching a die structure to the completed targetsubstrate to complete formation of the assembly; and affixing thecompleted target substrate across the antenna on another substrate. 3.The method of claim 1, further comprising: testing functionality of theassembly, marking the assembly as defective, and removing the assemblyfrom a web.
 4. The method of claim 1, wherein the antenna is a coilantenna of a radio frequency identification (RFID) tag that comprisesthe target substrate.
 5. The method of claim 1, further comprising: aweb of antenna strap-interposers that are printed or ablated withrespective first portions of common ground test structures.
 6. Themethod of claim 5, wherein the dielectric structures are printed orablated over the respective first portions of the common groundstructures.
 7. The method of claim 6, further comprising: printing orablating respective second portions of the common ground structures overthe dielectric structures to form completed target substrates upon whichdie structures are attached.
 8. The method of claim 7, furthercomprising: forming rolls of completed target substrates that have beensuccessfully tested and individualized.
 9. The method of claim 8,wherein the strap-interposer includes connect pad areas, the methodfurther comprising: applying a lamination of patterned, gummedpressure-sensitive adhesive (PSA) construction that cover portions ofthe completed target substrates of the rolls and that leave theconnecting pad areas of the completed target substrates uncovered. 10.The method of claim 9, further comprising separating individual ones ofthe completed target substrates of the rolls the resulting viadie-cutting that leaves connections of the common ground testingstructure intact.
 11. The method of claim 1, wherein the antenna isconfigured in a pattern for incorporation into security features of atleast one of currency, postage stamps, or tax stamps, or into productlabels.
 12. The method of claim 1, wherein the antenna is incorporatedinto product labels, or wherein the antenna is incorporated intomaterials of a roll that comprise the substrate.
 13. The method of claim1, wherein the method is performed by an integrated circuit-controlledejection system (ICCES) for massively parallel integrated circuitassembly (MPICA).
 14. A target substrate with a strap-interposerassembled according to the method of claim
 1. 15. An integratedcircuit-controlled ejection system (ICCES) for massively parallelintegrated circuit assembly (MPICA) configured to form a targetsubstrate with a strap-interposer, the ICCES comprising: a firstformation device configured to form the strap-interposer on the targetsubstrate based on one or more dimensions of an antenna for the targetsubstrate; a second formation device configured to form a first portionof a common ground testing structure that is electrically coupled to thestrap-interposer, the common ground testing structure configured to testfunctionality of an assembly; a third formation device configured toform a dielectric structure over the first portion of the common groundtest structure and the strap-interposer; a fourth formation deviceconfigured to form a completed target substrate by forming a secondportion of the common ground testing structure over the dielectricstructure and that is electrically coupled to the strap interposer; anda placement device configured to attach a die structure to the completedtarget substrate to complete formation of an assembly.